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Contract is for $12.5 million from leading European brand of solar panels.
July 7, 2017
By: DAVID SAVASTANO
Editor, Ink World Magazine
REC Group has awarded Meyer Burger a contract for the delivery and installation of the latest generation DW 288 Series 3 diamond wire cutting platform for multi-crystalline silicon block slicing. Total contract volume is approximately CHF 12 million ($12.5 million) and delivery of the equipment will start in Q3 2017. REC Group is an integrated European brand for solar panels that will shift its entire multi-silicon wafer slicing to diamond wire cutting technology. REC Group has selected Meye...
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